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The 7th International Conference on
Electronics Materials and Packaging will be held at Tokyo Institute of
Technology, Japan. The former six conferences were held in Singapore
(1999), Hong Kong (2000), Korea (2001), Taiwan (2002), Singapore (2003)
and Malaysia (2004) all of which were successful and have gained a
reputation as a premier electronics materials and packaging conference in
Asia Pacific where the bulk of the packaging activities are taking
place.The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. This will also provide an excellent opportunity for researchers and engineers to gather to discuss generic and practical applications and new directions.
The organizing committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. Contributions are very welcome from industry participants and researchers from academic institutions. The topics of interests are specific to micro systems/MEMS, their packaging, electronics materials and reliability issues. Papers are being sought from, but not limited to, the following subjects:
- Automotive Electronics
- Chip-Scale Packaging/Flip Chip
- Electrical Modeling & Signal Integrity
- Electronic Inspection
- Green Materials
- High Density Displays
- High Density Packaging
- Interconnection Technologies
- Low Cost Packaging Methods
- Manufacturing Technologies
- Mechanical Modeling and Structural Integrity
- MEMS Packaging and Applications
- Microelectronic Materials & Processes
- No Flow Underfilling Process
- Optoelectronics/Photonics
- Polymer Materials & Microelectronic Applications
- Printed Wiring and Flex Boards
- Quality & Reliability
- Thermal Design, Analysis, and Characterization
- Thick & Thin Film Materials
- Wafer Scale Packaging
- Wireless Sensor Packaging & Applications
- Vibration on Electronic Devices
Submission of Abstract:June 30, 2005July 15, 2005
Notification of Acceptance: July 31, 2005
Submission of Manuscript: September 30, 2005
